Ceramic shell and tube packaging technology and equipment

Release time:

2024-05-11 08:42

Source:

In the field of semiconductor precision device packaging, ceramic tube shell packaging has become an irreplaceable packaging form due to its superior high air tightness, high thermal conductivity, high moisture resistance, high mechanical strength, high insulation resistance and other properties, especially suitable for high-power electronic products and high-demand military and aerospace products.

The main ceramic materials used are aluminum oxide, beryllium oxide and aluminum nitride.

Common ceramic package shell for the following 3 kinds:

The dual in-line package shell is a through-hole package composed of a sintered ceramic substrate, and the copper-plated pins are parallel to the edges of the substrate. This kind of package shell has high reliability, simple process and good heat dissipation performance. The pin flat package tube shell is a kind of sealed SMD. The ceramic and pin frame are sealed together through glass to complete the connection between internal chips and external and circuit board. Ceramic pin grid matrix package, through ceramic through hole mount device, gold plated pins on the top or bottom of the base. Small size, good heat dissipation performance, superior electrical performance.

At present, the cover of the shell and the cover plate of the ceramic tube shell is generally used in the form of resistance welding, and the "seam welding" is carried out by using the principle of parallel sealing welding ". The package forms are square seal, round seal and array seal.

Beijing Aote Hengye Electrical Equipment Co., Ltd. has several sets of unique technical solutions in the field of semiconductor device packaging, which can provide better parameter matching for different devices.

The company currently has 3 parallel sealing welding machines and manual, semi-automatic and full-automatic parallel sealing welding machines, which can ensure that the water and oxygen content in the airtight environment of the device sealing welding is below 10ppm, and can seal and weld devices with rectangular devices of 2 to 180mm in size and circular diameter less than 150mm. The cover plate design is automatically carried, and the spot welding or roll welding capacity per hour is 180 to 300, the fitting and alignment accuracy of the tube shell and the cover plate is less than or equal to plus or minus 35 microns. The equipment has high precision and stable operation.

Vacuum type parallel sealing welding application and sealing welding equipment

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