Principle of parallel sealing welding

Release time:

2024-01-05 16:01

Source:

Parallel sealing is a fusion welding method, which is widely used in optical communication devices and semiconductor devices. By using the electrodes to apply pressure and intermittent energization, the heat energy generated by the contact and resistance between the electrodes is used to melt and combine the metal cover plate with the tube shell coating to achieve airtight welding. This method ensures the isolation of the die and circuit from the external environment, prevents harmful atmosphere attack, and limits the content of water vapor and free particles in the package cavity.

In the packaging process of optoelectronic devices and semiconductor devices, parallel sealing plays a key role. After the device is placed in the metal, glass or ceramic tube housing base, to ensure that the device is not affected by oxidation and the internal normal operation, a vacuum treatment is required to reduce the humidity and oxygen content in the lumen. An inert gas such as nitrogen is introduced during the soldering process to protect the device. By adding a cover plate and using the principle of resistance welding, the metal is melted under the action of current and the solder joint is formed under pressure to complete the sealing welding process.

Aote Hengye's parallel sealing machine provides packaging solutions for products such as optoelectronic devices and semiconductor devices. It covers a rectangular tube shell of 2mm to 180mm and a circular tube shell with a diameter of less than 150mm, and the welding force can be adjusted to 2 to 20 N. Production capacity of up to 150 to 300 units per hour (depending on the device), with high precision and good cost performance.

The equipment has automatic pre-welding function, and can add automatic cover module. The shaping and positioning of the cover plate is realized through a high-performance machine vision recognition system to ensure accurate placement. The automatic upper cover module supports three modes: material tray, cartridge and vibration tray. At the same time, it can be equipped with auxiliary configurations such as vacuum heating box and discharge bin to enhance the flexibility and functionality of the equipment.

The application of Aote Hengye parallel sealing machine provides efficient, accurate and reliable solutions for optical communication devices and semiconductor device packaging, meeting different packaging needs and promoting industry development.

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